Wide Bandgap Power Semiconductor Packaging
  • Author : Katsuaki Suganuma
  • Release Date : 28 May 2018
  • Publisher : Woodhead Publishing
  • Genre : Technology & Engineering
  • Pages : 240
  • ISBN 13 : 9780081020951

Wide Bandgap Power Semiconductor Packaging Book Summary

Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability addresses the key challenges that WBG power semiconductors face during integration, including heat resistance, heat dissipation and thermal stress, noise reduction at high frequency and discrete components, and challenges in interfacing, metallization, plating, bonding and wiring. Experts on the topic present the latest research on materials, components and methods of reliability and evaluation for WBG power semiconductors and suggest solutions to pave the way for integration. As wide bandgap (WBG) power semiconductors, SiC and GaN, are the latest promising electric conversion devices because of their excellent features, such as high breakdown voltage, high frequency capability, and high heat-resistance beyond 200 C, this book is a timely resource on the topic. Examines the key challenges of wide bandgap power semiconductor packaging at various levels, including materials, components and device performance Provides the latest research on potential solutions, with an eye towards the end goal of system integration Discusses key problems, such as thermal management, noise reduction, challenges in interconnects and substrates

Wide Bandgap Power Semiconductor Packaging

Wide Bandgap Power Semiconductor Packaging

Author : Katsuaki Suganuma
Publisher : Woodhead Publishing
Genre : Technology & Engineering
Total View : 5183 Views
File Size : 46,5 Mb
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Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability addresses the key challenges that WBG power semiconductors face during integration, including heat resistance, heat dissipation and thermal stress, noise reduction at high frequency and discrete components, and challenges in interfacing, metallization, plating, bonding and wiring. Experts on the topic present ...

Wide Bandgap Semiconductor Power Devices

Wide Bandgap Semiconductor Power Devices

Author : B. Jayant Baliga
Publisher : Woodhead Publishing
Genre : Technology & Engineering
Total View : 1388 Views
File Size : 46,5 Mb
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Wide Bandgap Semiconductor Power Devices: Materials, Physics, Design and Applications provides readers with a single resource on why these devices are superior to existing silicon devices. The book lays the groundwork for an understanding of an array of applications and anticipated benefits in energy savings. Authored by the Founder of ...

Disruptive Wide Bandgap Semiconductors  Related Technologies  and Their Applications

Disruptive Wide Bandgap Semiconductors Related Technologies and Their Applications

Author : Yogesh Kumar Sharma
Publisher : BoD – Books on Demand
Genre : Technology & Engineering
Total View : 464 Views
File Size : 52,6 Mb
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SiC and GaN devices have been around for some time. The first dedicated international conference on SiC and related devices, "ICSCRM," was held in Washington, DC, in 1987. But only recently, the commercialization of SiC and GaN devices has happened. Due to its material properties, Si as a semiconductor has limitations ...

Wide Bandgap Semiconductors for Power Electronics

Wide Bandgap Semiconductors for Power Electronics

Author : Peter Wellmann,Noboru Ohtani,Roland Rupp
Publisher : John Wiley & Sons
Genre : Technology & Engineering
Total View : 9289 Views
File Size : 47,8 Mb
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Wide Bandgap Semiconductors for Power Electronic A guide to the field of wide bandgap semiconductor technology Wide Bandgap Semiconductors for Power Electronics is a comprehensive and authoritative guide to wide bandgap materials silicon carbide, gallium nitride, diamond and gallium(III) oxide. With contributions from an international panel of experts, the ...

Wafer Level Chip Scale Packaging

Wafer Level Chip Scale Packaging

Author : Shichun Qu,Yong Liu
Publisher : Springer
Genre : Technology & Engineering
Total View : 4921 Views
File Size : 48,9 Mb
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Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers ...

Thermal and Electro thermal System Simulation 2020

Thermal and Electro thermal System Simulation 2020

Author : Márta Rencz,Lorenzo Codecasa,Andras Poppe
Publisher : MDPI
Genre : Technology & Engineering
Total View : 991 Views
File Size : 43,8 Mb
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This book, edited by Prof. Marta Rencz and Prof Andras Poppe, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects fourteen papers carefully selected for the “thermal and electro-thermal system simulation” Special Issue of Energies. These contributions present the latest results in a currently ...

Semiconductor Power Devices

Semiconductor Power Devices

Author : Josef Lutz,Heinrich Schlangenotto,Uwe Scheuermann,Rik De Doncker
Publisher : Springer
Genre : Technology & Engineering
Total View : 2767 Views
File Size : 41,8 Mb
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Halbleiter-Leistungsbauelemente sind das Kernstück der Leistungselektronik. Sie bestimmen die Leistungsfähigkeit und machen neuartige und verlustarme Schaltungen erst möglich. In dem Band wird neben den Halbleiter-Leistungsbauelementen selbst auch die Aufbau- und Verbindungstechnik behandelt: von den physikalischen Grundlagen und der Herstellungstechnologie über einzelne Bauelemente bis zu thermomechanischen Problemen, Zerstö...

Theory and Practice of Thermal Transient Testing of Electronic Components

Theory and Practice of Thermal Transient Testing of Electronic Components

Author : Marta Rencz,Gábor Farkas,András Poppe
Publisher : Springer Nature
Genre : Technology & Engineering
Total View : 8437 Views
File Size : 42,9 Mb
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This book discusses the significant aspects of thermal transient testing, the most important method of thermal characterization of electronics available today. The book presents the theoretical background of creating structure functions from the measured results with mathematical details. It then shows how the method can be used for thermal qualification, ...