[PDF] Modeling Analysis Design And Tests For Electronics Packaging Bey

Author : Hengyun Zhang
Release Date : 22 November 2019
Publisher : Woodhead Publishing
Genre : Technology & Engineering
Pages : 434
ISBN 13 : 9780081025338

Download Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore eBook in PDF, Epub and Kindle

Book Description: Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included. Includes advanced modeling and analysis methods and techniques for state-of-the art electronics packaging Features experimental characterization and qualifications for the analysis and verification of electronic packaging design Provides multiphysics modeling and analysis techniques of electronic packaging

Modeling Analysis Design and Tests for Electronics Packaging beyond Moore

Author : Hengyun Zhang,Faxing Che,Tingyu Lin,Wensheng Zhao
Publisher : Woodhead Publishing
Genre : Technology & Engineering
Get Book

Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and ...

Modeling Analysis Design and Tests for Electronics Packaging Beyond Moore

Author : 张恒运,车法星,林挺宇,赵文生
Publisher : Unknown
Genre : Electronic apparatus and appliances
Get Book

...

Advances in Robotics Automation and Data Analytics

Author : Jessnor Arif Mat Jizat,Ismail Mohd Khairuddin,Mohd Azraai Mohd Razman,Ahmad Fakhri Ab. Nasir,Mohamad Shaiful Abdul Karim,Abdul Aziz Jaafar,Lim Wei Hong,Anwar P. P. Abdul Majeed,Pengcheng Liu,Hyun Myung,Han-Lim Choi,Gian-Antonio Susto
Publisher : Springer Nature
Genre : Technology & Engineering
Get Book

This book presents essentially a collection of proceedings that deliberate on the key challenges and recent trends on robotics, automation and data analytics which are the pillars of Industry 4.0. Solutions that are employed in the multitude spectra of innovative robotics & automation and data analytics are discussed. The readers are expected ...

Heat Exchangers

Author : Laura Castro Gómez,Víctor Manuel Velázquez Flores,Miriam Navarrete Procopio
Publisher : BoD – Books on Demand
Genre : Technology & Engineering
Get Book

The demand for energy to satisfy the basic needs and services of the population worldwide is increasing as are the economic costs associated with energy production. As such, it is essential to emphasize energy recovery systems to improve heat transfer in thermal processes. Currently, significant research efforts are being conducted ...

Springer Handbook of Experimental Solid Mechanics

Author : William N. Sharpe
Publisher : Springer Science & Business Media
Genre : Mathematics
Get Book

As a reference book, the Springer Handbook provides a comprehensive exposition of the techniques and tools of experimental mechanics. An informative introduction to each topic is provided, which advises the reader on suitable techniques for practical applications. New topics include biological materials, MEMS and NEMS, nanoindentation, digital photomechanics, photoacoustic characterization, ...

Arbitrary Modeling of TSVs for 3D Integrated Circuits

Author : Khaled Salah,Yehea Ismail,Alaa El-Rouby
Publisher : Springer
Genre : Technology & Engineering
Get Book

This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, ...

Op Amps for Everyone

Author : Ron Mancini
Publisher : Newnes
Genre : Technology & Engineering
Get Book

The operational amplifier ("op amp") is the most versatile and widely used type of analog IC, used in audio and voltage amplifiers, signal conditioners, signal converters, oscillators, and analog computing systems. Almost every electronic device uses at least one op amp. This book is Texas Instruments' complete professional-level tutorial and ...

System Design Modeling and Simulation Using Ptolemy II

Author : Claudius Ptolemaeus
Publisher : Lee & Seshia
Genre : Computers
Get Book

This book is a definitive introduction to models of computation for the design of complex, heterogeneous systems. It has a particular focus on cyber-physical systems, which integrate computing, networking, and physical dynamics. The book captures more than twenty years of experience in the Ptolemy Project at UC Berkeley, which pioneered ...

Routing Congestion in VLSI Circuits

Author : Prashant Saxena,Rupesh S. Shelar,Sachin Sapatnekar
Publisher : Springer Science & Business Media
Genre : Technology & Engineering
Get Book

This volume provides a complete understanding of the fundamental causes of routing congestion in present-day and next-generation VLSI circuits, offers techniques for estimating and relieving congestion, and provides a critical analysis of the accuracy and effectiveness of these techniques. The book includes metrics and optimization techniques for routing congestion at ...

VLSI Systems Design

Author : Anonim
Publisher : Unknown
Genre : Integrated circuits
Get Book

...

Integrated Circuit Test Engineering

Author : Ian A. Grout
Publisher : Springer Science & Business Media
Genre : Technology & Engineering
Get Book

Using the book and the software provided with it, the reader can build his/her own tester arrangement to investigate key aspects of analog-, digital- and mixed system circuits Plan of attack based on traditional testing, circuit design and circuit manufacture allows the reader to appreciate a testing regime from ...

Three dimensional Integrated Circuit Design

Author : Vasilis F. Pavlidis,Eby G. Friedman
Publisher : Morgan Kaufmann
Genre : Technology & Engineering
Get Book

With vastly increased complexity and functionality in the "nanometer era" (i.e. hundreds of millions of transistors on one chip), increasing the performance of integrated circuits has become a challenging task. Connecting effectively (interconnect design) all of these chip elements has become the greatest determining factor in overall performance. 3-D ...

CMOS

Author : R. Jacob Baker
Publisher : John Wiley & Sons
Genre : Technology & Engineering
Get Book

Praise for CMOS: Circuit Design, Layout, and SimulationRevised Second Edition from the Technical Reviewers "A refreshing industrial flavor. Design concepts are presented as they are needed for 'just-in-time' learning. Simulating and designing circuits using SPICE is emphasized with literally hundreds of examples. Very few textbooks contain as much detail as ...

Chips 2020

Author : Bernd Hoefflinger
Publisher : Springer Science & Business Media
Genre : Science
Get Book

The chips in present-day cell phones already contain billions of sub-100-nanometer transistors. By 2020, however, we will see systems-on-chips with trillions of 10-nanometer transistors. But this will be the end of the miniaturization, because yet smaller transistors, containing just a few control atoms, are subject to statistical fluctuations and thus ...

Life Cycle Assessment of Semiconductors

Author : Sarah B. Boyd
Publisher : Springer Science & Business Media
Genre : Technology & Engineering
Get Book

Life-Cycle Assessment of Semiconductors presents the first and thus far only available transparent and complete life cycle assessment of semiconductor devices. A lack of reliable semiconductor LCA data has been a major challenge to evaluation of the potential environmental benefits of information technologies (IT). The analysis and results presented in ...