Adhesion in Microelectronics
  • Author : K. L. Mittal
  • Release Date : 25 August 2014
  • Publisher : John Wiley & Sons
  • Genre : Technology & Engineering
  • Pages : 368
  • ISBN 13 : 9781118831342

Adhesion in Microelectronics Book Summary

This comprehensive book will provide both fundamental andapplied aspects of adhesion pertaining to microelectronics in asingle and easily accessible source. Among the topics to be coveredinclude; Various theories or mechanisms of adhesion Surface (physical or chemical) characterization of materials asit pertains to adhesion Surface cleaning as it pertains to adhesion Ways to improve adhesion Unraveling of interfacial interactions using an array ofpertinent techniques Characterization of interfaces / interphases Polymer-polymer adhesion Metal-polymer adhesion (metallized polymers) Polymer adhesion to various substrates Adhesion of thin films Adhesion of underfills Adhesion of molding compounds Adhesion of different dielectric materials Delamination and reliability issues in packaged devices Interface mechanics and crack propagation Adhesion measurement of thin films and coatings

Adhesion in Microelectronics

Adhesion in Microelectronics

Author : K. L. Mittal,Tanweer Ahsan
Publisher : John Wiley & Sons
Genre : Technology & Engineering
Total View : 8890 Views
File Size : 45,8 Mb
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This comprehensive book will provide both fundamental andapplied aspects of adhesion pertaining to microelectronics in asingle and easily accessible source. Among the topics to be coveredinclude; Various theories or mechanisms of adhesion Surface (physical or chemical) characterization of materials asit pertains to adhesion Surface cleaning as it pertains to adhesion ...

Adhesion Measurement of Films   Coatings

Adhesion Measurement of Films Coatings

Author : K. L. Mittal
Publisher : VSP
Genre : Technology & Engineering
Total View : 5780 Views
File Size : 45,5 Mb
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This book documents the proceedings of the Second International Symposium on Adhesion Measurement of Films and Coatings, held in Newark, NJ, October 25-27, 1999. Since the First Symposium (Boston 1992) there had been considerable activity in devising new, more reliable and more efficient ways to measure adhesion of films and coatings, which ...

Progress in Adhesion and Adhesives

Progress in Adhesion and Adhesives

Author : K. L. Mittal
Publisher : John Wiley & Sons
Genre : Technology & Engineering
Total View : 821 Views
File Size : 53,5 Mb
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With the ever-increasing amount of research being published it is a Herculean task to be fully conversant with the latest research developments in any field, and the arena of adhesion and adhesives is no exception. Thus, topical review articles provide an alternate and very efficient way to stay abreast of ...

Adhesion International 1993

Adhesion International 1993

Author : Louis H. Sharpe
Publisher : CRC Press
Genre : Technology & Engineering
Total View : 2720 Views
File Size : 55,5 Mb
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First published in 1996. ADHESION INTERNATIONAL 1993 is a volume of the Proceedings of the 16th Annual Meeting of The Adhesion Society, Inc. Williamsburg, Virginia, USA February 21-26,1993. This meeting featured an International Symposium on The Interphase....

Mechanics of Microelectronics

Mechanics of Microelectronics

Author : G.Q. Zhang,W.D. van Driel,X.J. Fan
Publisher : Springer Science & Business Media
Genre : Technology & Engineering
Total View : 5799 Views
File Size : 50,5 Mb
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This book is written by leading experts with both profound knowledge and rich practical experience in advanced mechanics and the microelectronics industry essential for current and future development. It aims to provide the cutting edge knowledge and solutions for various mechanical related problems, in a systematic way. It contains important ...

Microelectronics Packaging Handbook

Microelectronics Packaging Handbook

Author : R.R. Tummala,Eugene J. Rymaszewski,Alan G. Klopfenstein
Publisher : Springer Science & Business Media
Genre : Computers
Total View : 1086 Views
File Size : 48,7 Mb
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Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide ...

Handbook of Wafer Bonding

Handbook of Wafer Bonding

Author : Peter Ramm,James Jian-Qiang Lu,Maaike M. V. Taklo
Publisher : John Wiley & Sons
Genre : Science
Total View : 2730 Views
File Size : 46,5 Mb
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The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and ...

Dielectric Films for Advanced Microelectronics

Dielectric Films for Advanced Microelectronics

Author : Mikhail Baklanov,Karen Maex,Martin Green
Publisher : John Wiley & Sons
Genre : Technology & Engineering
Total View : 5266 Views
File Size : 47,7 Mb
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The topic of thin films is an area of increasing importance in materials science, electrical engineering and applied solid state physics; with both research and industrial applications in microelectronics, computer manufacturing, and physical devices. Advanced, high-performance computers, high-definition TV, broadband imaging systems, flat-panel displays, robotic systems, and medical electronics and ...